Automatic wafer engraving machine

TRFP8210 is a machine for wafer ID engraving and automatic rewinding and sorting machines; it can read the Wafer ID from the back of the wafer, and then engrave the WaferID onto the front of the wafer by laser engraving. At the same time, it can realize the function of wafer transfer from one WAFER CASSETTE to another WAFER CASSETTE. Use X, Y, Z, T four-axis robotic arm, FouP, round wafer transport box, Wafer ID OCR, Notch recognition, laser engraving to achieve high-precision wafer ID engraving, positioning and product transfer between different cassettes . The equipment can be used for 12-inch 8-inch wafers and various standard material boxes, and non-standard material boxes can also be customized. The equipment is controlled by an industrial computer and a 15-inch touch operation man-machine interface, which is easy and convenient to operate

Technical Data
Overview

	Project	Specification	Remarks
Specifications	Wafer size	8”&12’’ standard
	Lettering method	Laser lettering
	Support material box	Foup and round wafer transport magazine	Non-standard box can be customized
	Wafer turning device	Turning the wafer in the round wafer transport box and transferring the electrostatic paper
	Manipulator repeatability	Within ±0.1mm
	Average operating speed	UPH≥80
	Mapping function	Check whether the silicon wafers are stacked, oblique, and relative arpage in the material box
	Wafer warpage compatibility	Compatible with warpage ≤1000um
	Wafer thickness compatibility	Compatible wafer thickness range: 100-1500um
	Dimensions	1100mm(W)1450mm(L)1700mm(H)
Power	power source	single-phase 220V 50/60HZ
	Power	3KW
	Compressed air	0.5-0.7Mpa
	Weight	500Kg